Engineering Consulting Services

Clients chose to work with Lumenir because they share our belief that stunning design should be powered by engineering that delivers solutions ready for production in record time. no matter how big or small your problem may be, Lumenir can help.

There are a wide range of specialties within the field of electrical engineering including  computers, power engineering, telecommunications, control systems, RF engineering, signal processing, instrumentation, and microelectronics, which the team at Lumenir have respective expertise in.

The Lumenir hardware team focuses on delivering the right solution to your problem the first time – saving you time and money.

Whether you need a simple cost effective or a complex high-performance solution, Lumenir will get it done.

Our Capabilities Include:

      • Circuit Design
      • High-Speed Serial (SAS, SATA, PCIe)
      • Power Electronics
      • Mixed Signal

With a staff of veteran PCB designers most of which are degreed electrical engineers, our team is well equipped to understand and deliver your needs. Furthermore, each project is managed by a local senior electrical engineer with domain experience in your field who closely interfaces and collaborates with your team. Our goal is to minimize design churn and provide fast delivery with the highest quality.

If your design involves high-speed or RF, we have the staff and tools to help you with your Signal and Power Integrity needs.

Our process involves concurrent engineering. With an experienced staff of manufacturing engineers, we understand high volume manufacturing and bring extensive DFx knowledge to your design. As part of our design flow, we include a DFx review, all with the aim to get it right the first time. Our goal is to provide you with a smooth validation phase and smooth transfer to production.

We have worked extensible with the following interfaces:

    • PCIe Gen 3, Gen 4, Gen 5
    • FDR InfiniBand (56Gbps)
    • SAS-3 (12Gbps)
    • DDR, DDR2, DDR3, DDR4
    • ATCA & Micro-TCA
    • High power
    • Analog
    • Mixed Signal

Our Layout Capabilities include:

    • High-speed design
    • HDI Design
    • Micro-Vias
    • Via-in-Pad
    • High power density
    • RF and analog design
    • High density SMT designs
    • Flex PCB designs
    • Rigid-Flex PCB designs

Today's power dissipation requirements demands a more robust solution than forced air. Thermal management and cooling is crucial in today's power applications. 

Our team has worked with two phase immersion cooling achieving outstanding heat transfer results keeping the performance of the products delivered with high reliability. 

Let us help you with our experienced team and build an optimal solution towards your needs.

System Engineering is an interdisciplinary approach and means to enable the realization of successful systems, which is where Lumenir Innovations depth of experience really comes into its own. It focuses on defining customer needs and required functionality early in the development cycle, documenting requirements, then proceeding with design synthesis and system validation while considering the complete problem.

In addition, our team supports customers in Design data management services like PLM data management, Engineering change management etc.

Our team of seasoned mechanical engineers have developed many innovative and pioneering products over the years. Our team possesses multi-faceted experience in various Mechanical Engineering Services such as:

    • Packaging & enclosure design
    • Electro-mechanical design
    • Dynamic system design
    • Thermal engineering
    • Structural engineering
    • Material research & analysis
    • Shock & vibration analysis
    • Fluidics
    • Design for Manufacturing and Assembly analysis (DFMA)
  •  

Lumenir has extensive experience in packaging design from small-form factor SSDs, storage enclosures, to many consumer electronics products.  We work in a wide range of materials and processes for both low volume to high volume production:

    • Injection molding
    • Sheet metal
    • Machining
    • Casting
    • Extruding
    • Stamping

Whatever your needs, from rackmount storage enclosures to consumer electronics packaging, Lumenir can help.

Simulation of structural analysis is at the heart of robust and successful product design ensuring structural performance, such as strength and stiffness as well as provides critical understanding and systematic optimization of your designs throughout the product life cycle.  Through FEA (Finite-Element Analysis), our team is able to optimize our designs for performance and cost effectiveness while reducing costly iterations in prototyping and accelerate your time-to-market.

Some of our work includes:

  • Linear and Non-linear Analysis
  • Stress Analysis
  • Plastic Deformation
  • Creep Analysis
  • Fracture, Fatigue and Durability Analysis
  • Modal, Buckling, Non-Linear Analysis
  • Harmonic, Spectrum and Random Analysis
  • Transient Dynamic Analysis
  • Base Excitation, Rigid-Flexible Body Motion Analysis
  • Gear Design and Analysis
  • Mechanisms, Cam and Slot Design
  • Rendered Animations

Tools we use:

  • ANSYS
  • SolidWorks  Simulation

Our methods to predict the behavior of the components and materials temperature involve accurate modeling of fluid dynamics and heat transfer. We understand high volume manufacturing and bring extensive DFM and DFA knowledge to our solutions and to the application and design of thermal components such as heat sinks, air movers, thermal interface materials, adhesives, immersion cooling, and more.

Extensive Design Experience with:

    • Phase-change materials
    • Heat-pipes
    • Water cooling
    • Oil cooling
    • High power density
    • Military applications

We perform both steady-state and transient thermal analysis and model conduction, convection, radiation, and phase-change.

For fluid dynamics and airflow, we model inlet and outlet boundary conditions, steady-state and transient flow, as well as complex effects such as porosity, non-Newtonian viscosity, viscoelasticity, and more.

Even if you have a mature thermal testing program, up front simulation can save time and money by identifying locations of peak temperatures and critical heat flow routes. We exist to help you!

Our Capabilities:

    • Fluid Mechanics
    • Evaluate complex fluid flow
    • Evaluate complex effects such as porosity, cavitation, and humidity
    • Heat Transfer
    • CFD (Computational Fluid Dynamics) Analysis
    • Analyze thermal test data

Tools we use:

    • ANSYS Icepak
    • SolidWorks Flow Simulation

Download our Thermal Engineering data sheet to learn more.

Signal Integrity (SI) is essential for today’s high-speed designs. Our SI team has the tools and experience to solve the toughest problems.

With extensive experience of our team with high-speed memory systems (DDR3/4), high-speed serial links (SAS-3/12Gbps), PCIe Gen3, Gen4, Gen5, will be able help with the planning and validation of a design with pre-route and post-route simulation.

Power Integrity (PI) 

Voltage drop

Our services included:

    • 3D field-solver to generate transmission model
    • Pre-Route Modeling Simulation
    • Post-Route extraction
    • X-Talk Analysis
    • Power Integrity

Tools we use:

    • Agilent ADS
    • ANSYS HFSS™
    • Cadence® Allegro PCB SI
    • Cadence® PSpice®
    • Mentor Graphics®
    • HyperLynx®
    • Synopsys HSPICE®

The Lumenir firmware and software team has extensive experience and the skills to deliver your product to market fast.

Experience includes the following processors:

  • ARM V7, V8
  • PIC
  • x86/x64

Using the following tools and OS:

  • Assembly, C, C++, Python
  • Green Hills Software MULTI
  • Microchip MPLAB, KEIL, STM-Studio
  • Cypress PSoC Programmer
  • ThreadX, uVelosity, Nucleus, Linux, Windows, Android, iOS

Whether you need a complete software architecture or board bring-up, full firmware implementation or help with debug and test, scripting for functional test, Lumenir will get it done.

Our Program Management services are built with integrity, executed with experience, and delivered with a sense of certainty.

Using our long-established processes, tools, and techniques, we will define a specific set of activities and timeline to keep your project on target during the planning, execution and close out phases of your project. 

Our industry-recognized methods include risk and uncertainty management, probabilistic time and cost estimating, and detailed scheduling. Additionally, our experience negotiating and managing procurement, contracts and logistics helps lower your risk and cost of operation.

We also bring you a single point of contact for all aspects of project planning and execution, and we strive to improve the predictability of your project’s success, and provide you increased certainty. Our team continues to find areas to improve efficiency, reduce Cost of Poor Quality (COPQ), and ensure R&D costs are minimized.

There is a wide range of specialties within the field, which the Lumenir team all have respective expertise in. Our expertise covers the following areas:

  • Circuit Design
  • Component Selection / Evaluation
  • Circuit Modeling / Simulation
  • Circuit Optimization
  • FPGA Design
  • Signal Integrity (Pre and Post Route)
  • Power Integrity (IR drop, Impedance )
  • Power Distribution Network modeling 
  • EMI modeling
  • Electro-mechanical Design
  • High-Speed Serial (SAS, SATA, PCIe)
  • Power Electronics
  • High-Speed Serial (SAS, SATA, PCIe)
  • Power Electronics
  • DSP
  • Precision Timing
  • Battery & Battery Management
  • Audio
  • Acoustics
  • SBCs
  • Wireless (Bluetooth, GSM, WiFi)
  • Mixed Signal
  • FPGA & FPGA Verification (Xilinx, Altera, Lattice)
  • ASIC & ASIC Verification

With a staff of veteran PCB designers most of which are degreed electrical engineers, our team is well equipped to understand and deliver your needs. Furthermore, each project is managed by a local senior electrical engineer with domain experience in your field who closely interfaces and collaborates with your team. Our goal is to minimize design churn and provide fast delivery with the highest quality.

If your design involves high-speed or RF, we have the staff and tools to help you with your Signal and Power Integrity needs.

Our process involves concurrent engineering. With an experienced staff of manufacturing engineers, we understand high volume manufacturing and bring extensive DFx knowledge to your design. As part of our design flow, we include a DFx review, all with the aim to get it right the first time. Our goal is to provide you with a smooth validation phase and smooth transfer to production.


Platforms & Languages:

  • Linux, Windows
  • Verilog, VHDL, SystemVerilog

Vendors:

  • Altera
  • Lattice
  • Xilinx
  • Microsemi (previously Actel)

Process:

  • Up Front: Requirements, Power/Area Estimation, Pinout, SERDES, Clock domains, Special Functions
  • Development: Coding, Unit Test, Testbench, Timing Closure, Design tradeoffs, Documentation
  • Infrastructure: Source Code Control, Issue Tracking, Closed-loop Test, Build/Release Management, Metrics

How to Engage:
Lumenir can provide a turnkey solution or can work as an integrated member of a mature team. The method used is important, and we will calibrate the effort and approach in partnership with your team. Whether you have a framework in place or not, Lumenir can do the job, quickly and efficiently.

There is a wide range of specialties within the field, which the Lumenir team all have respective expertise in. Our expertise covers the following areas:

  • Circuit Design
  • Component Selection / Evaluation
  • Circuit Modeling / Simulation
  • Circuit Optimization
  • FPGA Design
  • Signal Integrity (Pre and Post Route)
  • Power Integrity (IR drop, Impedance )
  • Power Distribution Network modeling 
  • EMI modeling
  • Electro-mechanical Design
  • High-Speed Serial (SAS, SATA, PCIe)
  • Power Electronics
  • High-Speed Serial (SAS, SATA, PCIe)
  • Power Electronics
  • DSP
  • Precision Timing
  • Battery & Battery Management
  • Audio
  • Acoustics
  • SBCs
  • Wireless (Bluetooth, GSM, WiFi)
  • Mixed Signal
  • FPGA & FPGA Verification (Xilinx, Altera, Lattice)
  • ASIC & ASIC Verification

Our team of seasoned mechanical engineers have developed many innovative and pioneering products over the years. Our team possesses multi-faceted experience in various Mechanical Engineering Services such as:

  • Packaging & enclosure design
  • Electro-mechanical design
  • Dynamic system design
  • Thermal engineering
  • Structural engineering
  • Material research & analysis
  • Shock & vibration analysis
  • Acoustics
  • Fluidics
  • Design for Manufacturing and Assembly analysis (DFMA)

    Processes and Materials:

  • Injection molding
  • Sheet metal
  • Machining
  • Casting
  • Extruding
  • Stamping

In addition, our team supports customers in Design data management services like PLM data management, Engineering change management etc.

Prediction of component and material temperatures is the heart of many designs. We impact product design decisions by providing reliable design, analysis and thermal insights at the system architectural phase. Our diverse team understands how to balance thermal performance with other cross-functional interests.

Our methods involve accurate modeling of fluid dynamics and heat transfer. We understand high volume manufacturing and bring extensive DFM and DFA knowledge to our solutions and to the application and design of thermal components such as heat sinks, air movers, thermal interface materials, adhesives, and more.

Extensive Design Experience with:

  • Phase-change materials
  • Heat-pipes
  • Water cooling
  • Oil cooling
  • High power density
  • Military applications

We perform both steady-state and transient thermal analysis and model conduction, convection, radiation, and phase-change.

For fluid dynamics and airflow, we model inlet and outlet boundary conditions, steady-state and transient flow, as well as complex effects such as porosity, non-Newtonian viscosity, viscoelasticity, and more.

Even if you have a mature thermal testing program, up front simulation can save time and money by identifying locations of peak temperatures and critical heat flow routes. We exist to help you!

Our Capabilities:

  • Fluid Mechanics
  • Evaluate complex fluid flow
  • Evaluate complex effects such as porosity, cavitation, and humidity
  • Heat Transfer
  • CFD (Computational Fluid Dynamics) Analysis
  • Analyze thermal test data

Tools we use:

  • ANSYS Icepak
  • SolidWorks Flow Simulation

Download our Thermal Engineering data sheet to learn more.

Lumenir’s FPGA team has decades of experience with designs ranging from simple glue to major functional machines. The kinds of projects we’ve tackled include I/O expansion, serial communications protocol termination and adaption, cross-connect switches, DSP-in-FPGA, various bus protocols, SERDES, stratum timing and many more.

Platforms & Languages:

  • Linux, Windows
  • Verilog, VHDL, SystemVerilog

Vendors:

  • Altera
  • Lattice
  • Xilinx
  • Microsemi (previously Actel)

Process:

  • Up Front: Requirements, Power/Area Estimation, Pinout, SERDES, Clock domains, Special Functions
  • Development: Coding, Unit Test, Testbench, Timing Closure, Design tradeoffs, Documentation
  • Infrastructure: Source Code Control, Issue Tracking, Closed-loop Test, Build/Release Management, Metrics

How to Engage …
Lumenir can provide a turnkey solution or can work as an integrated member of a mature team. The method used is important, and we will calibrate the effort and approach in partnership with your team. Whether you have a framework in place or not, Lumenir can do the job, quickly and efficiently.

System Engineering is an interdisciplinary approach and means to enable the realization of successful systems, which is where Lumenir Innovations depth of experience really comes into its own. It focuses on defining customer needs and required functionality early in the development cycle, documenting requirements, then proceeding with design synthesis and system validation while considering the complete problem.

The Lumenir firmware and software team has extensive experience and the skills to deliver your product to market.

Experience includes the following processors:

  • ARM
  • PowerPC
  • V850
  • ST10
  • PIC
  • PSoC
  • 8051
  • x86/x64

Using the following tools and OS:

  • Assembly, C, C++ Languages
  • Green Hills Software MULTI
  • Microsoft Visual Studio
  • Microchip MPLAB
  • Cypress PSoC Programmer
  • ThreadX, uVelosity, Nucleus, Linux, Windows, Android, iOS

Whether you need a complete software architecture or board bring-up, full firmware implementation or help with debug and test, Lumenir will get it done.

Lumenir has extensive experience in packaging design from small-form factor SSDs, storage enclosures, to many consumer electronics products.  We work in a wide range of materials and processes for both low volume to high volume production:

  • Injection molding
  • Sheet metal
  • Machining
  • Casting
  • Extruding
  • Stamping

For example, our team members developed packaging for an enterprise SSD which improved mechanical performance, electrical reliability, increased capacity, lowered cost, improved manufacturability, and improved thermal performance. Our team has a proven track record of innovation that takes companies to the next level.

Whatever your needs, from rackmount storage enclosures to consumer electronics packaging, Lumenir can help.

Simulation is at the heart of robust and successful product design ensuring structural performance, such as strength and stiffness as well as provides critical understanding and systematic optimization of your designs throughout the product life cycle.  Through FEA (Finite-Element Analysis), our team is able to optimize our designs for performance and cost-effectiveness while reducing costly iterations in prototyping and accelerate your time-to-market.

Some of our work includes:

  • Linear and Non-linear Analysis
  • Stress Analysis
  • Plastic Deformation
  • Creep Analysis
  • Fracture, Fatigue and Durability Analysis
  • Modal, Buckling, Non-Linear Analysis
  • Harmonic, Spectrum and Random Analysis
  • Transient Dynamic Analysis
  • Base Excitation, Rigid-Flexible Body Motion Analysis
  • Gear Design and Analysis
  • Mechanisms, Cam and Slot Design
  • Rendered Animations

Tools we use:

  • ANSYS
  • SolidWorks  Simulation

The Lumenir hardware team focuses on delivering the right solution to your problem the first time – saving you both time and money.

Whether you need a simple cost effective or a complex high-performance solution, Lumenir will get it done.

Our Capabilities Include:

  • Circuit Design
  • High-Speed Serial (SAS, SATA, PCIe)
  • Power Electronics
  • DSP
  • Precision Timing
  • Battery & Battery Management
  • Audio
  • Acoustics
  • SBCs
  • Wireless (Bluetooth, GSM, WiFi)
  • Mixed Signal
  • FPGA & FPGA Verification (Xilinx, Altera, Lattice)
  • ASIC & ASIC Verification

Our Program Management services are built with integrity, executed with experience, and delivered with a sense of certainty.

Using our long-established processes, tools, and techniques, we will define a specific set of activities and timeline to keep your project on target during the planning, execution and close out phases of your project. 

Our industry-recognized methods include risk and uncertainty management, probabilistic time and cost estimating, and detailed scheduling. Additionally, our experience negotiating and managing procurement, contracts and logistics helps lower your risk and cost of operation.

We also bring you a single point of contact for all aspects of project planning and execution, and we strive to improve the predictability of your project’s success, and provide you increased certainty. Our team continues to find areas to improve efficiency, reduce Cost of Poor Quality (COPQ), and ensure R&D costs are minimized.

"The Lumenir team comprises members of the engineering elite, each bringing domain experience and depth of knowledge in their respective fields."

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Our seasoned team has extensive experience in product realization and has delivered many innovative products to high volume production for some of the largest, most recognizable companies in the world as well as for small entrepreneurial startups.

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